STMicroelectronics is a French-Italian multinational electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. It is Europe's largest semiconductor chip maker based on revenue. ST is among the world leaders in a broad range of segments, including semiconductors for industrial applications, inkjet printheads, MEMS (Micro-Electro-Mechanical Systems), MPEG decoders and smartcard chips, automotive integrated circuits, computer peripherals, and chips for wireless and mobile applications.
While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands.
The company’s US headquarters is in Coppell, Texas. Headquarters for the Asia-Pacific region is in Singapore whilst Japan and Korea operations are headquartered in Tokyo. The company headquarters for the Greater China region is in Shanghai.
- Mikatech ST Microelectronics MCU reverse engineer list:
- GALxx Series mcu code recovery: GAL16V8 GAL16V8A ... GAL20V8 GAL20V8A ... GAL22V10 ... GAL6001 ....
STM8Lxx Series mcu code recovery: STM8L101F2 STM8L101F3 STM8L101G2 STM8L101G3 STM8L101K3 STM8L151C4 STM8L151C6 STM8L151G4 STM8L151G6 STM8L151K4 STM8L151K6 STM8L152C4 STM8L152C6 STM8L152K4 STM8L152K6 ...
STM8Sxx Series mcu reverse engineer: STM8S103 STM8S105 STM8S207 STM8S208 STM8S903 STM8S103F2 STM8S103F3 STM8S103K3 STM8S105C4 STM8S105C6 STM8S105K4 STM8S105K6 STM8S105S4 STM8S105S6 STM8S207C6 STM8S207C8 STM8S207CB STM8S207K6 STM8S207M8 STM8S207MB STM8S207R6 STM8S207R8 STM8S207RB STM8S207S6 STM8S207S8 STM8S207SB STM8S208C6 STM8S208C8 STM8S208CB STM8S208M8 STM8S208MB STM8S208R6 STM8S208R8 STM8S208RB STM8S208S6 STM8S208S8 STM8S208SB STM8S903F3 STM8S903K3...
STM32F/32Lxx Series mcu source code recovery: STM32F100V STM32F101 STM32F103 STM32F105 STM32F107RC STM32L151 STM32L152 STM32F205 STM32F207 STM32F215 STM32F217 STM32F405 STM32F407 STM32F415 STM32F417 STM32L151 STM32L152 STM32F101RE STM32F101RD STM32F205RC STM32F101VE STM32F101VD STM32F100RE STM32F103RE STM32F100VE STM32F100RD STM32F103RD STM32F100VD STM32F103VD STM32F100ZD STM32F205VC STM32F207VC STM32F205ZC STM32F105VC STM32F105RC STM32F101RC STM32F107RC STM32F101VC STM32F107VC STM32F101ZC STM32F100RC STM32F103RC STM32F100VC STM32F103VC STM32F100ZC STM32F205RB STM32L151CB STM32L152CB STM32L151RB STM32L152RB STM32F205VB STM32L15VB STM32F105VB STM32L152VB STM32F103ZC STM32F103TB STM32F101CB STM32F103CB STM32F101RB STM32F103RB STM32F101VB STM32F107VB STM32F101TB STM32F100CC STM32F102CB STM32F100RB STM32F102RB STM32F100VB STM32F103VB STM32L151C8 STM32L152C8 STM32F103C8 STM32F102C8 STM32L152C6 STM32F103C6 STM32F102C6 STM32F103C4 STM32F102C4 STM32L151R8 STM32F105R8 STM32F103T8 STM32F101T8 STM32F101C8 STM32F100C8 STM32L151C6 STM32F101R8 STM32F100R8 STM32L151R6 STM32F101R6 STM32F100R6 STM32F101R4 STM32F100R4 STM32F407VG STM32F417VG STM32F407ZG STM32F417ZG STM32F405RG STM32F415RG STM32F405VG STM32F415VG STM32F405ZG STM32F415ZG STM32F207VG STM32F217VG STM32F207ZG STM32F217ZG STM32F205RG STM32F215RG STM32F205VG STM32F215VG STM32F205ZG STM32F215ZG STM32F101RG STM32F103RG STM32F101VG STM32F103VG STM32F101ZG STM32F103ZG STM32F205RF STM32F101RF STM32F103RF STM32F205VF STM32F101VF STM32F407VE STM32F207VE STM32F207VF STM32F103VF STM32F417VE STM32F217VE STM32F215VE STM32F103VE STM32F205ZF STM32F101ZF STM32F407ZE STM32F207ZE STM32F205ZE STM32F101ZE STM32F100ZE STM32F101ZD STM32F103ZD STM32F207ZC STM32F207IC STM32F103VE STM32F207ZF STM32F103ZF STM32F417ZE STM32F217ZE STM32F215ZE STM32F407IE STM32F207IE STM32F417IE STM32F217IE STM32F207IF STM32F207IG STM32F217IG STM32F407IG STM32F417IG STM32F205RE STM32F215RE STM32F205VE ...
ST62E/63Exx Series mcu eeprom reverse engineer: ST62E01 ST62E18CF1 ST62E20CF1 ST62E20 ST62E25 ST62E28CF1 ST62E28C6 ST62E30B ST62E32BF1 ST62E40BG1 ST62E42BG1 ST62E46BG1 ST62E60 ST62E62 ST62E65 ST62E80B ST62E85BG1 ST62E01C ST63E73 ST62E01 ST62E01CF1 ST62E18CF1 ST62E20CF1 ST62E20 ST62E20B ST62E20C ST62E25 ST62E25C ST62E25CF1 ST62E28CF1 ST62E28C6 ST62E30B ST62E30BF1 ST62E32BF1 ST62E40BG1 ST62E42BG1 ST62E46BG1 ST62E60B ST62E60C ST62E62CF1 ST62E62B ST62E62C ST62E65B ST62E65C ST62E65CF1 ST62E80B ST62E80BG1 ST62E85BG1 ST62E01C ...
ST62Txx Series mcu code recovery: ST62T00 ST62T00C ST62T01 ST62T01C ST62T03 ST62T03C ST62T08 ST62T08C ST62T09 ST62T09C ST62T10 ST62T10C ST62T15 ST62T15C ST62T18C ST62T18C6 ST62T20 ST62T20B ST62T20C ST62T25 ST62T25C ST62T28C ST62T28C6 ST62T30B ST62T32B ST62T40B ST62T42B ST62T46B ST62T52B ST62T52C ST62T53B ST62T53C ST62T55B ST62T55C ST62T60B ST62T60C ST62T60C6 ST62T62B ST62T62C ST62T63B ST62T63C ST62T65B ST62T65C ST62T80B ST62T85B(Q6) ST63E73 ST72C104G1M ST72C104G1B ST62T85B ...
ST72Cxx Series mcu firmware duplication: ST72C104G2B ST72C104G2M ST72C124J2B ST72C124J2T ST72C215G1B ST72C215G1M ST72C215G2B ST72C215G2M ST72C216G1B ST72C216G1M ST72C216G2B ST72C216G2M ST72C254G1B ST72C254G1M ST72C254G2B ST72C254G2M ST72C314J2B ST72C314J2T ST72C314J4B ST72C314J4T ST72C314N2 ST72C314N4 ST72C314N4 ST72C314N2B ST72C314N2T ST72C314N4B ST72C314N4T ST72C334N2B ST72C334N2T ST72C334N4B ST72C334N4T ...
ST72Fxx Series mcu eeprom code recovery: ST72F260G1B6 ST72F260G1M6 ST72F262G1B6 ST72F262G1M6 ST72F262G2B6 ST72F262G2M6 ST72F264G1B6 ST72F264G1M6 ST72F264G2B6 ST72F264G2H1 ST72F264G2H6 ST72F264G2M6 ST72F321AR6T6 ST72F321AR6TA ST72F321AR7T6 ST72F321AR7TA ST72F321AR9T6 ST72F321AR9TA ST72F321AR9TC ST72F321BAR6T6 ST72F321BAR6TA ST72F321BAR7T6 ST72F321BAR7TA ST72F321BAR9T6 SST72F321BAR9TA ST72F321BAR9TC ST72F321BJ7T6 ST72F63BK6B ST72F651AR6T ...
ST72Txx Series mcu eeprom data reverse engineer: ST72T101G1B ST72T101G1M ST72T101G2B ST72T101G2M ST72T121J2B ST72T121J2T ST72T121J4B ST72T121J4T ST72T141K2B ST72T141K2M ST72T212G1B ST72T212G1M ST72T212G2B ST72T212G2M ST72T213G1B ST72T213G1M ST72T213G2B ST72T213G2M ST72T251G1B ST72T251G1M ST72T251G2B ST72T251G2M ST72T272K2B ST72T272K4B ST72T272K4M ST72T311J2B ST72T311J2T ST72T311J4B ST72T311J4T ST72T311N2B ST72T311N2T ST72T311N4B ST72T311N4T ST72T311R6T ST72T311R7T ST72T311R9T ST72T331J2B ST72T331J4B ST72T331J2T ST72T331J4T ...
ST92Fxx Series mcu source code recover: ST92F120V1 ST92F120JV1 ST92F120JV9 ST92F120V9 ST92F124R9 ST92F124V1 ST92F124V1 ST92F1 50CV1 ST92F150CV1 ST92F150CV9 ST92F150JDV1 ST92F250CV2 ST92F150JDV1 ST92F250CV2 ...
PSDxx Series mcu reverse engineer: PSD211R PSD301 PSD302 PSD303 PSD311 PSD312 PSD313 PSD813F1 PSD813F2 PSD813F3 PSD813F5 PSD833F2 ...
uPSDxx Series mcu firmware code retreive: uPSD3212C uPSD3233B uPSD3234 uPSD3253B uPSD3254 uPSD3312D uPSD3333D uPSD3334D uPSD3354D uPSD3422E uPSD3433E uPSD3434E uPSD3454E ...
STMicroelectronics was formed in 1987 by the merger of semiconductor companies SGS Microelettronica (Società Generale Semiconduttori) of Italy and Thomson Semiconducteurs, the semiconductor arm of France's Thomson. At the time of the merger the company was known as SGS-THOMSON but took its current name in May 1998 following the withdrawal of Thomson SA as an owner.
SGS Microelettronica and Thomson Semiconducteurs were both long-established semiconductor companies. SGS Microelettronica originated in 1972 from a previous merger of two companies:
ATES (Aquila Tubi e Semiconduttori), a vacuum tube and semiconductor maker headquartered in the Abruzzese city of l'Aquila, which in 1961 changed its name to Azienda Tecnica ed Elettronica del Sud and relocated its manufacturing plant to the outskirts of the Sicilian city of Catania
Società Generale Semiconduttori (founded in 1957 by Adriano Olivetti).
Thomson Semiconducteurs was created in 1982 by the French government's widespread nationalisation of industries. It included:
the semiconductor activities of the French electronics company Thomson.
Mostek, a US company founded in 1969 by some ex-employees of Texas Instruments.
Silec, founded in 1977.
Eurotechnique founded in 1979 in Rousset, Bouches-du-Rhône as a joint-venture between Saint-Gobain of France and US-based National Semiconductor.
EFCIS, founded in 1977.
SESCOSEM, founded in 1969.
After its creation by merger in 1987, SGS-Thomson was ranked 14th among the top 20 semiconductor suppliers with sales of around US$850 million. The company has participated in the consolidation of the semiconductor industry since its formation, with acquisitions including:
In 1989, British company Inmos known for its transputer microprocessors from parent Thorn EMI.
In 1994, Canada-based Nortel's semiconductor activities.
In 2002, Alcatel's Microelectronics division, which along with the incorporation of smaller ventures such as UK company, Synad Ltd, helped the company expand into the Wireless-LAN market.
In 2007, US-based Genesis Microchip. Genesis Microchip is known for their strength in video processing technology (Faroudja) and has design centres located in Santa Clara, Toronto, Taipei City, Taiwan R.O.C. and Bangalore.
On 8 December 1994, the company completed its initial public offering on the Paris and New York stock exchanges. Owner Thomson SA sold its stake in the company in 1998 when the company also listed on the Borsa Italiana in Milan.
Buy-out of VLSI Vision Ltd.
In 2002, Motorola and TSMC joined ST and Philips in a new technology partnership. The Crolles2 Alliance was created with a new 12" wafer manufacturing facility located in Crolles (France).
By 2005, STMicroelectronics was ranked fifth, behind Intel, Samsung, Texas Instruments and Toshiba, but ahead of Infineon, Renesas, NEC, NXP, and Freescale. The company was the largest European semiconductors supplier, ahead of Infineon and NXP (see Semiconductor sales leaders by year).
Early in 2007, NXP (formerly Philips Semiconductors) and Freescale (formerly Motorola Semiconductors) decided to stop their participation in Crolles2 Alliance. Under the terms of the agreement the Alliance came to an end on 31 December 2007.
On May 22, 2007, ST and Intel created a joint venture in the memory application called Numonyx. This new company merged ST and Intel Flash Memory activities.
Semiconductor market consolidation continued with ST and NXP announcing on April 10, 2008, the creation of a new joint venture of their mobile activities, with ST owning 80% of the new company and NXP 20%. This joint venture began on August 20, 2008.
On February 10, 2009 ST Ericsson, a joint venture bringing together ST-NXP Wireless and Ericsson Mobile Platforms, was established.
In 2011, STMicroelectronics announced the creation of a joint lab with Sant'Anna School of Advanced Studies. The lab will focus on research and innovation in bio-robotics, smart systems and microelectronics. Past collaborations with Sant'Anna School of Advanced Studies included DustBot, a platform that integrated self-navigating "service robots" for waste collection.
As of 2012 the shareholders were:
72.4% public (New York Stock Exchange, Euronext Paris, Borsa Italiana Milano)
27,6% STMicroelectronics Holding II B.V.
100% STMicroelectronics Holding N.V.
50% Fonds stratégique d'investissement of France (previously FT1CI (Areva and Commissariat à l'Energie Atomique))
50% Ministero dell'Economia e delle Finanze of Italy (Finmeccanica until 2004, Cassa Depositi e Prestiti until 2010, both between 2004-2009)
ST focuses its product strategy on sense and power technologies, automotive products and embedded-processing solutions.
Sense and Power: The segment encompasses MEMS and sensors, power discrete, and advanced analog products. It is a simple indication that our analog products can be used to design any system requiring semiconductors from sensors, signal channel devices, output power stages –discrete and/or integrated, as well as the complete power management blocks. Complemented by a comprehensive collection of modern microcontrollers, the Sense & Power analog devices can fulfill the needs of any design.
Automative Products: The Automotive portfolio covers all key application areas from powertrain and safety to car body and infotainment. ST has been historically one of the leading suppliers and innovators in the domain of semiconductor devices dedicated to automotive applications. With a portfolio spanning from complex power train microcontrollers, audio and infotainment devices and body and convenience dedicated and standard functions, ST continues to maintain the leading edge position and focus. The products designed and manufactured specifically for automotive applications are complemented by a large range of “automotive grade” products, both tested and guaranteed to perform under the stringent automotive environmental conditions.
Embedded - Processing Solutions: The Embedded Processing Solutions include microcontrollers (ST6, ST7, µPSD, ST9, ST10, STR7, STR9, STM8, STM32 STM-MCU), Discrete semiconductor products, digital consumer and imaging products, application processor. It comprises consumer, multimedia, wireless and wireline products. Digital consumer application specific standard products (ASSPs) such as coders and decoders for MPEG-2 and MPEG-4. Wireless ASICs. Smartcards. Electronic Passports
Following an earlier failure, STMicroelectronics has stayed out of the volatile markets for DRAM and PC microprocessors. In 1994, it attempted to launch compatible Intel 80486 microprocessors in partnership with American company Cyrix. One model only was completed, the 1995 Cyrix M1 microprocessor, which was intended to compete with Intel's Pentium family.
It did achieve some success, however, in the PC-compatible x86 embedded systems market with its STPC SoC line, culminating in the 486-class STPC Atlas, which reached end-of-life in 2008.
Research & Development
Since its creation, ST has maintained an unwavering commitment to R&D. Almost one quarter of its employees work in R&D and product design and in 2012 the company spent about 28% of its revenue in R&D(1). Among the industry’s most innovative companies, ST owns about 16,000 patents, about 9,000 patent families and 515 new filings. The Company draws on a rich pool of chip fabrication technologies, including advanced FD-SOI (Fully Depleted Silicon-on-Insulator) CMOS (Complementary Metal Oxide Semiconductor), mixed-signal, analog and power processes, and is a partner in the International Semiconductor Development Alliance (ISDA) for the development of next-generation CMOS technologies.
Each group is composed of several divisions or business units. Each division is responsible for the design, industrialization, manufacturing and marketing for its own product portfolio. Operations are assisted by a central R&D organisation and the local sales offices. The company has 16 research and development units and 39 design and application centers.
Unlike so-called fabless semiconductor companies, STMicroelectronics owns and operates its own semiconductor wafer fabs. To provide its customers with an independent, secure and cost-effective manufacturing machine, ST operates a worldwide network of front-end (wafer fabrication) and back-end (assembly and test and packaging) plants. The company owned five 8 inch (200 mm) wafer fabs and one 12 inch (300 mm) wafer fab in 2006. Most of the production is scaled at 0.18 µm, 0.13 µm, 90 nm and 65 nm (measurements of transistor gate length). STMicroelectronics also owns back-end plants, where silicon dies are assembled and bonded into plastic or ceramic packages. 
Major sites include:
Grenoble is one of the company's most important R&D centres, employing around 6,000 staff. The Polygone site employs 2200 staff and is one of the historical bases of the company (ex SGS). All the historical wafer fab lines are now closed but the site hosts the headquarters of many divisions (marketing, design, industrialization) and an important R&D center, focused on silicon and software design and fab process development.
The Crolles site hosts an 8 inch (200 mm) and a 12 inch (300 mm) fab and was originally built as a common R&D center for submicrometre technologies as part of the 1990 Grenoble 92 partnership between SGS-Thomson and CNET, the R&D center of French telecom company France Telecom. The 8 inch (200 mm) fab, known as Crolles 1, is the company's first and was built as part of a 1991 partnership between SGS-Thomson and Philips to develop new manufacturing technologies. Crolles 1 was opened on 9 September 1993 by Gérard Longuet, French minister for industry.
The 12 inch (300 mm) fab was inaugurated by French president Jacques Chirac, on 27 February 2003. It includes a R&D center which focuses on developing new nanometric technology processes for 90 nm to 32 nm scale using 12 inch (300 mm) wafers and it was developed for The Crolles 2 Alliance'. This alliance of STMicroelectronics, TSMC, NXP Semiconductors (formerly Philips semiconductor) and Freescale (formerly Motorola semiconductor) partnered in 2002 to develop the facility get hex code
source code recovery
protect erase and to work together on process development. The technologies developed at the facility were also used by global semiconductor foundry TSMC of Taiwan, allowing TSMC to build the products developed in Crolles on behalf of the Alliance partners who required such foundry capacity.
Employing around 3,000 staff, Rousset hosts several division headquarters including smartcards, microcontrollers, and EEPROM as well as several R&D centers. Rousset also hosts an 8 inch (200 mm) fab which was opened on 15 May 2000 by French prime minister Lionel Jospin.
The site opened in 1979 as a 4 inch (100 mm) fab opertated by Eurotechnique, a joint venture between Saint Gobain of France and National Semiconductor of the US. Rousset was extract encryption
source code retreive
security sold to Thomson-CSF in 1982 as part of the French government's 1981-82 nationalization of several industries. As part of the nationalisation, a former Thomson plant in the center of Aix-en-Provence operating since the 1960s was closed and staff were transferred to the new Rousset site. The read protected HEX
data code fuses
open a locked Microcontroller original 4 inch (100 mm) fab was upgraded into 5 inch (130 mm) and later 6 inch (150 mm) fab in 1996. It is now being shut down.
In 1988, a small group of employees from the Thomson Rousset plant (including the director, Marc Lassus) founded a start-up company, Gemalto (formerly known as Gemplus) which mcu lockbit lock
read-out of an EEPROM processor
dump flash and eeprom became a leader in the smartcard industry.
Employing 1500 staff, this site hosts a fab and R&D centers.
Employing 6,000 staff, the Milan facilities match Grenoble in importance. Agrate Brianza (map), employs around 4000 staff and is a historical base of the company (ex SGS). The site has several fab lines (including an 8 inch (200 mm) fab) and decapsulation and code recovery
copy contents of crypto memory
disassemble file an R&D center. Castelletto, employs 300 to 400 staff and hosts some divisions and R&D centers.
Update-2012: Numonyx JV (with Intel) is acquired by Micron As such, R2 Fab (Agrate previous R&D 200mm Fab) is currently a Micron entity
The Catania plant in Sicily employs 5,000 staff and hosts several R&D centers and divisions, focusing on flash memory technologies as well as two fabs. The plant was launched in 1961 by ATES to supply under licensing to RCA of the US and initially using Germanium. The site's two major wafer fabs are * an 8 inch (200 mm) fab, opened in April 1997 by Romano Prodi, president recovering protected code
remove the protection fuses
read Memory of the Italian council and a 12 inch (300 mm) fab that has never been completed and which was transferred in its current state to Numonyx in 2008.
ST employs some 1,500 people in Malta, making it the largest private sector employer. It is also the country's leading exporter.
Ang Mo Kio, Singapore
In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh. Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its first copy eeproms
get bin code
recovery read data wafers in 1984. Converted up to 8 inch (200 mm) fab, this is now an important 8 inch (200 mm) wafer fab of the group. Ang Mo Kio also hosts some design centers. The site currently employs 6000 staff.
Update-2012: Numonyx JV (with Intel) is acquired by Micron in 2010. As such, AMK8 Fab (200mm HVM Fab) is currently a Micron entity. AMK5 and AMK6 remains to be STM entities.
Application, design and support. ~300 employees. Divisions: MCD, FTM, HVD.
Geneva, Switzerland: Corporate headquarter which hosts most of the ST top management. It totals some hundred of employees.
Saint-Genis-Pouilly, France, near Geneva: A few hundred of employees. Headquarters for logistics.
Paris: Marketing and support.
Malta: In 1981, SGS-Thomson (now STMicroelectronics) built its first assembly plant in Malta. STMicroelectronics is, as of 2008, the largest private employer on the island, employing around 1,800 people.
Muar, Malaysia: around 4000 employees. This site was built in 1974 by Thomson and is now an assembly plant.
Shenzhen, Guangdong province, China, near Hong Kong: In 1994, ST and the Shenzhen Electronics Group signed a partnership to construct and jointly operate an assembly plant (ST has majority with 60%). The plant is located in Futian Free Trade Zone and became read ROM
obtain source code operational in 1996. It has around 3,300 employees. A new assembly plant is planned in Longgang for 2008. The R&D, design, sales and marketing office is located in the Hi-tech industrial park in Nanshan district.
Calamba City, in the province of Laguna, Philippines,: In 2008, ST acquired this plant from NXP Semiconductors. Initially as part of joint venture with NXP but later acquired the whole share turning it into a full pledge STMicroelectronics Assembly and Testing plant. Currently it employs 2,000 employees.
Bristol, UK: approx. 200 employees. This R&D site was built for the British company Inmos which in 1978 began development of the famous Transputer microprocessor. The site was acquired with Inmos in 1994, and is now primarily involved with the design of home video and code read Microprocessor
read security bytes
break password entertainment products (Set-Top Box), GPS chips, and accompanying software. This site will close on March 31st 2014, marking the end of an era.
Rabat, Morocco: A design center that employs 160 people.
Naples, Italy: A Design center employing 300 people.
Lecce, Italy: HW & SW Design Center which hosts 20 researchers in the Advanced System Technology group.
Ang Mo Kio, Singapore: In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh. Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to retrieving hex source code
source code blocked
break protect code produce its first wafers in 1984. Converted up to 8 inch (200 mm) fab, this is now an important 8 inch (200 mm) wafer fab of the ST group. Ang Mo Kio also hosts design centers for various groups.
Greater Noida, India: The Noida site was launched in 1992 to conduct software engineering activities. A silicon design center was inaugurated on 14 February 1995. With 120 employees, it was the largest design center of the company outside Europe at the time. In 2006, the site was shifted to Greater Noida for further expansion. The site hosts mainly design teams. It is now primarily involved copy an encrypted IC
decrypting memory dump with the design of home video products (Set-Top Box, DVD), GPS and Wireless LAN chips, and accompanying software. World wide Data center support is also transferred to Greater Noida in 2004. The employee strength in Greater Noida is around 2000. This also includes employees of ST-Ericsson.
San Jose, California, (Silicon Valley), USA): 120 staff in marketing, design and applications.
La Jolla, California, (San Diego, USA): 80 staff in design and applications.
Lancaster, Pennsylvania, U.S.: Application, support, and marketing.
Prague, Czech Republic: 100 to 200 employees. Application, design and support.
Tunis, Tunisia: 300 employees. Support, Application, TR&D, design and support.
Sophia Antipolis, near Nice, France: Design center with a few hundred employees.
Edinburgh, Scotland: Design center.
Ottawa, Canada: In 1993, SGS-Thomson purchased the semiconductor activities of Nortel which owned in Ottawa an R&D center and a fab. The fab was closed in 2000, however, a design, R&D centre and sales office is operating in the city.
Toronto, Canada: HW & SW Design Center primarily involved with the design of video processor ICs as part of ST's TVM Division.
Palermo, Sicily, Italy: Design Center.
Bangalore, India: HW and SW design center employing more than 250 people (Including the employees of ST Ericsson and Genesis Microchip).
Zaventem, Belgium: 100 employees. Design & Application Center.
Helsinki, Finland: Design Center.
Turku, Finland: Design Center.
Oulu, Finland: Design Center.
Tampere, Finland: Design Center.
Longmont, Colorado USA: Design Center.
Closing sites[edit source | editbeta]
The Phoenix, Arizona 8 inch (200 mm) fab, the Carrollton, Texas 6 inch (150 mm) fab, and the Ain Sebaa, Morocco fab are beginning rampdown plans, and are destined to close by 2010.
The Casablanca, Morocco site consists of two assembly parts (Bouskoura and Aïn Sebaâ) and totals around 4000 employees. It was recover code from encrypted
hacking hex file opened in the 1960s by Thomson. ST is Morocco's biggest exporter.
The Bristol, United Kingdom site (approx. 150 employees) is scheduled to ramp down and close by early 2014.
The Ottawa, Canada plant (approx. 450 employess) will close down by 2013 end.
Rennes, France hosted a 6 inch (150 mm) fab and was closed in 2004
Rancho Bernardo, California, a 4 inch (100 mm) fab created by Nortel and purchased by SGS-Thomson in 1994, after which it was converted into a 6 inch (150 mm) fab in 1996.
SGS's first presence in the US was a sales office based in Phoenix in the early 1980s. Later, under SGS-Thomson, an 8 inch (200 mm) fab was completed in Phoenix in 1995. The company's second 8" fab after Crolles 1, the site was first dedicated to producing lockbits activated
read out memory microprocessors for Cyrix. On July 10, 2007, ST said that it would close this site, and in July 2010 the shell of the Phoenix PF1 FAB was bought by Western Digital Corporation.
The Carrollton, Texas site was built in 1969 by Mostek, an American company founded by former employees of Texas Instruments. In 1979 Mostek was acquired by United Technologies which sold it to Thomson Semiconducteurs in 1985. Initially equipped with a 4 inch (100 mm) fab, it was converted into a 6 inch (150 mm) fab in 1988. The Colorado Springs activities of British company INMOS were Read Data from EEprom
read eeprom data transferred to Carrolton in 1989 following its acquisition by SGS Thomson. Since then the site has been refocused to wafer testing. On July 10, 2007, ST announced it would close this fab, and it was finally closed in 2010.
STMicroelectronics and Hynix of South Korea have created a joint-venture to construct a wafer fab for nand flash memories. STMicroelectronics has a 33% stake in ST/Hynix which was intended to be operational by the end of 2006.
STMicroelectronics is negotiating with Chinese joint venture foundry Hua Hong NEC Electronics Co. Ltd. located in Shanghai to build a 12 inch (300 mm) fab in China. Foundry owners are Hua Hong and NEC of Japan.
On August 8, 2007 ST bought Nokia's microchip development team and plans to invest heavily in development of cellular ASIC applications. The purchase included Nokia's ASIC team in Southwood (UK) and the company plans several sites in Finland.
STMicroelectronics is involved in a project to produce plastic solar cells that employ a matrix of carbon nanotubes to convert photons to electrical power